Press Release| Technosoft Innovations Announces the Scholarship Award Winners
Morrisville, NC, June 15, 2018 Technosoft Innovations is honored to announce the winner of its Scholarship Program 2017-18. Eshaan Paresh Shah has been selected as the recipient of our $500 cash scholarship. Eshaan is a full-time student at Rochester Institute of Technology.
Technosoft Innovations received an overwhelming response from the students across the globe. The expert panel comprising of Technosoft Innovations directors and external industry experts carefully reviewed all the entries and released the list of shortlisted candidates. The expert panel gave a majority vote to Eshaan’s essay.
About the Technosoft Innovations Scholarship Program
Technosoft believes that young minds are always full of innovative and brilliant ideas. The scholarship program was announced to lookout for bright and talented youngsters. Technosoft aimed to help students explore their creativity and originality through this scholarship. Technosoft understands the high costs associated while pursuing higher education. In the ever-changing economy, it is hard to predict the cost of education, so they believe every bit of help matters.
So, keeping these aspects in mind Technosoft presented the Technosoft Innovations Scholarship Program 2017-18 on 1st June 2017. This scholarship awards the innovative and forward-thinking students. To qualify for this scholarship, students had to be enrolled for any program or course in any school or university across the world. The amount of the scholarship can be used by the winner for any expense which may be related or unrelated to his/her educational pursuit.
The entries were accepted till 31st May 2018. The students had to submit a 1000 words essay on either one of the topic Recent Developments in the Medical Industry or Recent Developments in the Electronics Industry. The essay had to be written in English language and submitted as a word document.
About Technosoft Innovations
Headquartered in Morrisville, North Carolina, Technosoft Innovation is a leading medical and electronic product design and development company. We offer end-to-end solutions from concept to building prototype, minimizing risks, testing for safety, and reducing your development cycle. It is a subsidiary of Technosoft Engineering which is a global engineering services provider. Technosoft offers a complete spectrum of custom engineering design services and solutions. It offers multi-disciplinary services through all the aspects of engineering from concept design to process optimization, from designing and detailing to an engineering analysis, from EPCM services to broad range of IT Service Offerings.
Why Technosoft Innovations
- The product designs at Technosoft Innovations are driven by innovation and focus on compliance, reliability and IP security.
- We have in-house capabilities for rapid prototyping, safety, design verification builds, and temperature cycle testing.
- A strong team of product designers specializing in FDA Class I and II medical devices.
- Flexible solutions and engagement models along with strong NPI infrastructure set up in the USA as well as India for comprehensive design to proto solutions.
- ISO 13485 certified design solutions with risk management framework according to ISO 14971, UL, IEC and CE product.
- Diversified and reliable product design competence for Test, Manufacture, and Assembly.
$500 Technosoft Innovations, Inc Scholarship – Shortlisted Candidates
Technosoft Innovations is glad to release the list of shortlisted candidates for our scholarship program. Our judges will announce the winner on 15th June 2018 by 10.00 am PST.
|Charles Cardenaz||Brigham Young University-Idaho|
|Sarah Boloko||Highline Community College|
|Robel Ponds||University of St Thomas|
|Haylie Marie Jesch||Central Arizona College|
|McKenna Cox||Snow College|
|Joy Johnson||University of South Alabama|
|Laura Rebecca Jones||Rocky Mountain University of Health Professions|
|Eshaan Paresh Shah||Rochester Institute of Technology|
|Alexandra Fontes||Juniata College|
|Layla Tyree David||University of Arkansas|
|Daniel Eley||Blackhawk Technical College|
|Ruben Antonio Rosa Polonia||Embry-Riddle Aeronautical University|
President & CEO Girish Godbole speaks on Technosoft’s Multidisciplinary Product Engineering Services under one roof
Technosoft Engineering President & CEO, Girish Godbole speaks with SiliconIndia magazine regarding Technosoft’s end-to-end product engineering services. During the interview, Mr. Godbole emphasized on the Technosoft’s growth strategy, experienced engineering and leadership team, and use of leading-edge technology to deliver innovative and reliable engineering design and development services. Mr. Godbole’s full interview with the SiliconIndia magazine can be accessed below.
NCBIO Medical Device Forum 2017
Date: May 16th, 2017
Technosoft Innovations Sponsored the “NCBIO Medical Device Forum 2017” held on 16th May 2017 at Raleigh, North Carolina.
The conference was attended by the delegates who were interested in medical devices and FDA approvals. The experts and panelist guided and provided their useful insights to the attendees on Navigating FDA Approvals, Funding and Next Steps.
NCBIO is dedicated to promoting the future growth and development of North Carolina’s bioscience industry. NCBIO advocates for state and federal public policies that encourage the growth of life science companies, supports the development of a strong life science workforce, promotes research and technology transfer at universities and other institutions including support for capitalization and commercialization of products.
About Technosoft Innovations
Technosoft Innovation offer domain specific system level solutions for medical devices, consumer products, automotive infotronics and telecom equipment. We support customers in their new product introduction by providing a flexible and scalable operational model with latest technology, robust quality systems including ISO 13485 and stringent IP security. We also support FDA 510(k), UL, CE and other regulatory application processes.
Technosoft Innovations, Inc. is the product development arm of Technosoft Engineering, a multi-disciplinary engineering projects company with a team of 400+ engineers serving customers globally.
American Medical Device Summit 2016
Technosoft Innovations is participating in the American Medical Device Summit 2016, along with our partner Porticos.
Date: OCTOBER 5 – 6, 2016
Location: THE WESTIN LOMBARD YORKTOWN CENTER (70 Yorktown Center, Lombard, IL)
Technosoft along with Porticos, showcasing core service capabilities in the areas of end-to-end product development solutions for medical devices and presenting joint project development projects in the niche areas of medical devices, hand-held consumer electronics, telecommunication products and energy systems.
Meet our new Executive Vice President of Electronics Product Development
Executive Vice President
Date: June 23rd, 2016
Technosoft welcomes Mr. S Krishnakumar as our new Executive Vice President for Electronics Product Development Division.
With over 23 years of experience in Global OEM’s, Engineering Consulting Services, Contract Design and Manufacturing Environment, Krishna brings a robust mix of leadership, technology expertise, operational experience, technical breadth, and passion for customer service.
His key assignments have been in Global Product Development & Manufacturing Industry.
Krishna comes with vast experience in leading New Product Introductions, setting up teams from scratch, and growing business by successfully working with large diversified teams.
His role at Technosoft is to build & drive excellent service delivery, solution development and managing the growth strategy for the Electronics Product Development Business.
Prior to joining Technosoft, Krishna was associated with large MNC’s such as Larsen & Toubro, GE Healthcare, Shimadzu Asia Pacific, Infotech Enterprises & Sanmina-SCI.
Krishna holds a Bachelor’s in Electronics & Telecommunications Engineering from Anna University, Masters in Operations Management and MIS & PGD in Computer Application (Unix, C & Oracle).